IPACK2007 : proceedings of the ASME InterPACK conference -- 2007 -- : presented at 2007 ASME InterPACK conference : July 8-12, 2007 : Vancouver, BC Canada. : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : Jul 2007, Vancouver, Canada.

• 資料種別: 図書
• ISBN: 0791842770 (v. 1); 9780791842775 (ISBN-13 : v. 1); 0791842789 (v. 2)
• タイトル: IPACK2007 : proceedings of the ASME InterPACK conference -- 2007 -- : presented at 2007 ASME InterPACK conference : July 8-12, 2007 : Vancouver, BC Canada. : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : Jul 2007, Vancouver, Canada.
• 著者標目: Schmidt, Roger.; Miura, Hideo.; Suhling, J. C. (Jeffrey C.); ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2007 : Vancouver, B.C.)
• 出版事項: New York : ASME
• 出版年月日等: c2007.
• 出版年（W3CDTF）: 2007
• 数量: 2 v. : ill. ; 28 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Electronic packaging -- Congresses.
• NDLC: M17
• 一般注記: Papers.; "It was renamed InterPACK in 1995, and has been occurring biannually since then." -- p. iii.
• 書誌注記: Includes bibliographical references and author indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-08-687
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000009247937; http://id.ndl.go.jp/bib/000009247937
• OCLC番号: 191671386; https://www.worldcat.org/oclc/191671386
• 整理区分コード: 215

• 内容細目: Vol. 1: Advanced wafer level packaging : (...) : MEMS processing and fabricationVol. 2: Underfill and encapsulant effects on package reliability : (.....