IPACK2007 : proceedings of the ASME InterPACK conference -- 2007 -- : presented at 2007 ASME InterPACK conference : July 8-12, 2007 : Vancouver, BC Canada. : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : Jul 2007, Vancouver, Canada.

• Material Type: 図書
• ISBN: 0791842770 (v. 1); 9780791842775 (ISBN-13 : v. 1); 0791842789 (v. 2)
• Title: IPACK2007 : proceedings of the ASME InterPACK conference -- 2007 -- : presented at 2007 ASME InterPACK conference : July 8-12, 2007 : Vancouver, BC Canada. : ASME/Pacific Rim technical conference and exhibition on integration and packaging of MEMS, NEMS, and electronic systems : Jul 2007, Vancouver, Canada.
• Author Heading: Schmidt, Roger.; Miura, Hideo.; Suhling, J. C. (Jeffrey C.); ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2007 : Vancouver, B.C.)
• Publication, Distribution, etc.: New York : ASME
• Publication Date: c2007.
• Publication Date (W3CDTF): 2007
• Extent: 2 v. : ill. ; 28 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.
• NDLC: M17
• Note (General): Papers.; "It was renamed InterPACK in 1995, and has been occurring biannually since then." -- p. iii.
• Note (Bibliography): Includes bibliographical references and author indexes.
• Holding library: 国立国会図書館
• Call No.: M17-08-687
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000009247937; http://id.ndl.go.jp/bib/000009247937
• OCLC No.: 191671386; https://www.worldcat.org/oclc/191671386
• Bibliographic Record Category (NDL): 215

• Contents: Vol. 1: Advanced wafer level packaging : (...) : MEMS processing and fabricationVol. 2: Underfill and encapsulant effects on package reliability : (.....