2008 proceedings : thirteenth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2008 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/08 : 13th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2008, Fremont, CA.

2008 proceedings : thirteenth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2008 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/08 : 13th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2008, Fremont, CA.

国立国会図書館請求記号: M17-08-1214
国立国会図書館書誌ID: 000009350781

資料種別: 図書

著者: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (13th : 2008 : Fremont, Calif.)

出版者: [IMIC Headquarters?]

出版年: [2008]

資料形態: 紙

ページ数・大きさ等: 358 p. : ill. ; 28 cm.

NDC: -

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資料に関する注記

一般注記：: Program and papers."CMP-MIC Catalog No. 08 IMIC-3000P."

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紙

資料種別: 図書
タイトル: 2008 proceedings : thirteenth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2008 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/08 : 13th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2008, Fremont, CA.
著者標目: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (13th : 2008 : Fremont, Calif.)
出版事項: [Tampa] : [IMIC Headquarters?]
出版年月日等: [2008]
出版年（W3CDTF）: 2008
数量: 358 p. : ill. ; 28 cm.
並列タイトル等: 2008 proceedings : 13th international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California
2008 proceedings chemical-mechanical polish (CMP) for ULSI multilevel interconnection conference : March 4-6, 2008 -- Fremont, CA
出版地（国名コード）: US
本文の言語コード: eng
件名標目: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.
Integrated circuits -- Very large scale integration -- Design and construction -- Congresses.
Grinding and polishing -- Congresses.
NDLC: M17
一般注記: Program and papers.
"CMP-MIC Catalog No. 08 IMIC-3000P."
書誌注記: Includes bibliographical references.
所蔵機関: 国立国会図書館
請求記号: M17-08-1214
連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
書誌ID（NDLBibID）: 000009350781
http://id.ndl.go.jp/bib/000009350781
OCLC番号: 229018828
https://www.worldcat.org/oclc/229018828
整理区分コード: 215