2008 proceedings : thirteenth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2008 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/08 : 13th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2008, Fremont, CA.

• Material Type: 図書
• Title: 2008 proceedings : thirteenth international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California. : conference of IMIC : CMP-MIC/2008 : chemical-mechanical polish (CMP) planarization for on-chip ULSI multilevel interconnection applications : CMP-MIC/08 : 13th international C.M.P. planarization for ULSI multilevel interconnection conference : Mar 2008, Fremont, CA.
• Author Heading: International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference (13th : 2008 : Fremont, Calif.)
• Publication, Distribution, etc.: [Tampa] : [IMIC Headquarters?]
• Publication Date: [2008]
• Publication Date (W3CDTF): 2008
• Extent: 358 p. : ill. ; 28 cm.
• Alternative Title: 2008 proceedings : 13th international chemical-mechanical planarization for ULSI multilevel interconnection conference : (CMP-MIC) : a specialty conference of 2008 Microelectronics Institute Inter-on-Chip Connection : March 4-6, 2008 : Fremont Marriott Hotel : Fremont, California; 2008 proceedings chemical-mechanical polish (CMP) for ULSI multilevel interconnection conference : March 4-6, 2008 -- Fremont, CA
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Integrated circuits -- Ultra large scale integration -- Design and construction -- Congresses.; Integrated circuits -- Very large scale integration -- Design and construction -- Congresses.; Grinding and polishing -- Congresses.
• NDLC: M17
• Note (General): Program and papers.; "CMP-MIC Catalog No. 08 IMIC-3000P."
• Note (Bibliography): Includes bibliographical references.
• Holding library: 国立国会図書館
• Call No.: M17-08-1214
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000009350781; http://id.ndl.go.jp/bib/000009350781
• OCLC No.: 229018828; https://www.worldcat.org/oclc/229018828
• Bibliographic Record Category (NDL): 215