Proceedings of the ASME InterPack conference -- 2009 -- : presented at 2009 ASME InterPack conference : July 19-23, 2009 : San Francisco, California USA. : 2009 ASME summer conferences : Jul 2009, San Francisco, CA.

• 資料種別: 図書
• ISBN: 9780791843598 (pbk. : v. 1); 9780791843604 (pbk. : v. 2)
• タイトル: Proceedings of the ASME InterPack conference -- 2009 -- : presented at 2009 ASME InterPack conference : July 19-23, 2009 : San Francisco, California USA. : 2009 ASME summer conferences : Jul 2009, San Francisco, CA.
• 著者標目: American Society of Mechanical Engineers. Heat Transfer Division.; Suhling, J. C. (Jeffrey C.); Ishizuka, Masaru.; Tonapi, Sandeep Shrikant.; ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.)
• 出版事項: New York : ASME
• 出版年月日等: c2010.
• 出版年（W3CDTF）: 2010
• 数量: 2 v. : ill. ; 28 cm.
• 並列タイトル等: 2009 proceedings of the ASME InterPack conference : IPACK2009
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Electronic packaging -- Congresses.
• LCC: TK7870.15
• NDLC: M17
• 一般注記: Papers.; "The broad interdisciplinary program includes (...) tutorial shortcourses, and panels." -- welcome.
• 書誌注記: Includes bibliographical references and author indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-10-2749
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000010893895; http://id.ndl.go.jp/bib/000010893895
• OCLC番号: 547179293; https://www.worldcat.org/oclc/547179293
• 整理区分コード: 215

• 内容細目: Vol. 1: Advanced packaging : electro-thermal-mechanical issues in packaging: multi-physics : manufacturing and test : materials and processes : MEMS a...