Proceedings of the ASME InterPack conference -- 2009 -- : presented at 2009 ASME InterPack conference : July 19-23, 2009 : San Francisco, California USA. : 2009 ASME summer conferences : Jul 2009, San Francisco, CA.

• Material Type: 図書
• ISBN: 9780791843598 (pbk. : v. 1); 9780791843604 (pbk. : v. 2)
• Title: Proceedings of the ASME InterPack conference -- 2009 -- : presented at 2009 ASME InterPack conference : July 19-23, 2009 : San Francisco, California USA. : 2009 ASME summer conferences : Jul 2009, San Francisco, CA.
• Author Heading: American Society of Mechanical Engineers. Heat Transfer Division.; Suhling, J. C. (Jeffrey C.); Ishizuka, Masaru.; Tonapi, Sandeep Shrikant.; ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems (2009 : San Francisco, Calif.)
• Publication, Distribution, etc.: New York : ASME
• Publication Date: c2010.
• Publication Date (W3CDTF): 2010
• Extent: 2 v. : ill. ; 28 cm.
• Alternative Title: 2009 proceedings of the ASME InterPack conference : IPACK2009
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.
• LCC: TK7870.15
• NDLC: M17
• Note (General): Papers.; "The broad interdisciplinary program includes (...) tutorial shortcourses, and panels." -- welcome.
• Note (Bibliography): Includes bibliographical references and author indexes.
• Holding library: 国立国会図書館
• Call No.: M17-10-2749
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000010893895; http://id.ndl.go.jp/bib/000010893895
• OCLC No.: 547179293; https://www.worldcat.org/oclc/547179293
• Bibliographic Record Category (NDL): 215

• Contents: Vol. 1: Advanced packaging : electro-thermal-mechanical issues in packaging: multi-physics : manufacturing and test : materials and processes : MEMS a...