2008 international conference on electronic materials and packaging : (EMAP 2008) : Taipei, Taiwan : 22-24 October 2008. : 10th international conference on electronics materials and packaging : 3rd annual international event of IMPACT : 1st joint conference of IMPACT/EMAP : 3rd international microsystems, packaging, assembly and circuits technology conference : Oct 2008, Taipei, Taiwan.

• 資料種別: 図書
• ISBN: 9781424436200
• タイトル: 2008 international conference on electronic materials and packaging : (EMAP 2008) : Taipei, Taiwan : 22-24 October 2008. : 10th international conference on electronics materials and packaging : 3rd annual international event of IMPACT : 1st joint conference of IMPACT/EMAP : 3rd international microsystems, packaging, assembly and circuits technology conference : Oct 2008, Taipei, Taiwan.
• 著者標目: Components, Packaging & Manufacturing Technology Society. Taipei Chapter.; International Conference on Electronic Materials and Packaging (10th : 2008 : Taipei, Taiwan)
• 出版事項: Piscataway : IEEE
• 出版年月日等: c2008.
• 出版年（W3CDTF）: 2008
• 数量: 317 p. : ill. ; 27 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Electronic packaging -- Congresses.; Electronics -- Materials -- Congresses.
• LCC: TK7870.15
• NDLC: M17
• 一般注記: Papers.; Held in conjunction with TPCA Show.; IEEE cat no CFP08506-PRT.
• 書誌注記: Includes bibliographical references and author index.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-11-3109
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000011229514; http://id.ndl.go.jp/bib/000011229514
• OCLC番号: 402526624; https://www.worldcat.org/oclc/402526624
• 整理区分コード: 215