2008 international conference on electronic materials and packaging : (EMAP 2008) : Taipei, Taiwan : 22-24 October 2008. : 10th international conference on electronics materials and packaging : 3rd annual international event of IMPACT : 1st joint conference of IMPACT/EMAP : 3rd international microsystems, packaging, assembly and circuits technology conference : Oct 2008, Taipei, Taiwan.

• Material Type: 図書
• ISBN: 9781424436200
• Title: 2008 international conference on electronic materials and packaging : (EMAP 2008) : Taipei, Taiwan : 22-24 October 2008. : 10th international conference on electronics materials and packaging : 3rd annual international event of IMPACT : 1st joint conference of IMPACT/EMAP : 3rd international microsystems, packaging, assembly and circuits technology conference : Oct 2008, Taipei, Taiwan.
• Author Heading: Components, Packaging & Manufacturing Technology Society. Taipei Chapter.; International Conference on Electronic Materials and Packaging (10th : 2008 : Taipei, Taiwan)
• Publication, Distribution, etc.: Piscataway : IEEE
• Publication Date: c2008.
• Publication Date (W3CDTF): 2008
• Extent: 317 p. : ill. ; 27 cm.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Subject Heading: Electronic packaging -- Congresses.; Electronics -- Materials -- Congresses.
• LCC: TK7870.15
• NDLC: M17
• Note (General): Papers.; Held in conjunction with TPCA Show.; IEEE cat no CFP08506-PRT.
• Note (Bibliography): Includes bibliographical references and author index.
• Holding library: 国立国会図書館
• Call No.: M17-11-3109
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 000011229514; http://id.ndl.go.jp/bib/000011229514
• OCLC No.: 402526624; https://www.worldcat.org/oclc/402526624
• Bibliographic Record Category (NDL): 215