Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------.

• 資料種別: 図書
• ISBN: 9780735409385
• ISSN（シリーズ）: 0094243X
• タイトル: Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------.
• シリーズタイトル: AIP Conference Proceedings ; 1378
• タイトル標目: AIP conference proceedings ; no. 1378.
• 著者標目: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Albany, N.Y.); Zschech, Ehrenfried.; SEMATECH.; Fraunhofer IZFP, Dresden.; International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : San Francisco, Calif.); International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Dresden, Germany)
• 出版事項: Melville : American Institute of Physics
• 出版年月日等: 2011.
• 出版年（W3CDTF）: 2011
• 数量: vi, 175 p.
• 形態の詳細: ill.
• 大きさ: 25 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 件名標目: Three-dimensional integrated circuits--Design and construction--Congresses.; Stress relaxation--Simulation methods--Congresses.; Strains and stresses--Simulation methods--Congresses.; Strains and stresses--Measurement--Congresses.
• LCC: TK7874.893
• NDLC: M17
• 対象利用者: 一般
• 一般注記: Papers.; Held in Mar 2010, Albany, NY, U.S.A., Jul 2010, San Francisco, CA, U.S.A. and Oct 2010, Dresden, Germany.
• 書誌注記: Includes bibliographical references and author index.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-12-2241
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 023411711; http://id.ndl.go.jp/bib/023411711
• LC control number: 2011909347; https://lccn.loc.gov/2011909347
• OCLC番号: 756595612; https://www.worldcat.org/oclc/756595612
• 目録規則: 英米目録規則
• 整理区分コード: 215