Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------. (AIP Conference Proceedings ; 1378)

Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------.

(AIP Conference Proceedings ; 1378)

Call No. (NDL): M17-12-2241
Bibliographic ID of National Diet Library: 023411711

Material type: 図書

Author: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Albany, N.Y.)ほか

Publisher: American Institute of Physics

Publication date: 2011.

Material Format: Paper

Capacity, size, etc.: vi, 175 p. ; 25 cm.

NDC: -

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Notes on use

Note (General)：: Papers.Held in Mar 2010, Albany, NY, U.S.A., Jul 2010, San Francisco, CA, U.S.A. and Oct 2010, Dresden, Germany.

Other physical details：: ill.

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Paper

Material Type: 図書
ISBN: 9780735409385
ISSN (series): 0094243X
Title: Stress management for 3D ICs using through silicon vias : international workshop on stress management for 3D ICs using through silicon vias : Albany, NY, U.S.A. March 16, 2010 : San Francisco, CA, U.S.A. July 13, 2010 : Dresden, Germany October 20, 2010 : 2010, ------.
Series Title: AIP Conference Proceedings ; 1378
Title Heading: AIP conference proceedings ; no. 1378.
Author Heading: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Albany, N.Y.)
Zschech, Ehrenfried.
SEMATECH.
Fraunhofer IZFP, Dresden.
International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : San Francisco, Calif.)
International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 : Dresden, Germany)
Publication, Distribution, etc.: Melville : American Institute of Physics
Publication Date: 2011.
Publication Date (W3CDTF): 2011
Extent: vi, 175 p.
Other physical details: ill.
Size: 25 cm.
Place of Publication (Country Code): US
Text Language Code: eng
Subject Heading: Three-dimensional integrated circuits--Design and construction--Congresses.
Stress relaxation--Simulation methods--Congresses.
Strains and stresses--Simulation methods--Congresses.
Strains and stresses--Measurement--Congresses.
LCC: TK7874.893
NDLC: M17
Target Audience: 一般
Note (General): Papers.
Held in Mar 2010, Albany, NY, U.S.A., Jul 2010, San Francisco, CA, U.S.A. and Oct 2010, Dresden, Germany.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-12-2241
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 023411711
http://id.ndl.go.jp/bib/023411711
LC Control Number: 2011909347
https://lccn.loc.gov/2011909347
OCLC No.: 756595612
https://www.worldcat.org/oclc/756595612
Cataloging Rule: Anglo-American Cataloging Rules
Bibliographic Record Category (NDL): 215