Interconnect challenges for CMOS technology : materials, processes and reliability for downscaling, packaging and 3D stacking : April 9-13, 2012 : San Francisco, California, USA : Apr 2012, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1428)
Interconnect challenges for CMOS technology : materials, processes and reliability for downscaling, packaging and 3D stacking : April 9-13, 2012 : San Francisco, California, USA : Apr 2012, San Francisco, CA.
(Materials Research Society Symposia Proceedings ; 1428)
国立国会図書館請求記号
M17-13-3096
国立国会図書館書誌ID
024585404
資料種別
図書
著者
Interconnect Challenges for CMOS Technology -- Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking (Symposium) (2012 : San Francisco, Calif.)ほか