Interconnect challenges for CMOS technology : materials, processes and reliability for downscaling, packaging and 3D stacking : April 9-13, 2012 : San Francisco, California, USA : Apr 2012, San Francisco, CA. (Materials Research Society Symposia Proceedings ; 1428)

Interconnect challenges for CMOS technology : materials, processes and reliability for downscaling, packaging and 3D stacking : April 9-13, 2012 : San Francisco, California, USA : Apr 2012, San Francisco, CA.

(Materials Research Society Symposia Proceedings ; 1428)

Call No. (NDL): M17-13-3096
Bibliographic ID of National Diet Library: 024585404

Material type: 図書

Author: Interconnect Challenges for CMOS Technology -- Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking (Symposium) (2012 : San Francisco, Calif.)ほか

Publisher: Cambridge University Press

Publication date: c2012.

Material Format: Paper

Capacity, size, etc.: 87 p. ; 24 cm.

NDC: -

View All

Notes on use

Note (General)：: Papers.

Other physical details：: ill.

Search by Bookstore

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type: 図書
ISBN: 9781627482370 (paperback)
Title: Interconnect challenges for CMOS technology : materials, processes and reliability for downscaling, packaging and 3D stacking : April 9-13, 2012 : San Francisco, California, USA : Apr 2012, San Francisco, CA.
Series Title: Materials Research Society Symposia Proceedings ; 1428
Author Heading: Interconnect Challenges for CMOS Technology -- Materials, Processes and Reliability for Downscaling, Packaging and 3D Stacking (Symposium) (2012 : San Francisco, Calif.)
Dubois, Geraud.
Iacopi, F. (Francesca)
Sekiguchi, A. (Atsuko)
King, S. W. (Sean W.)
Dussarat, C. (Christian)
Materials Research Society. Spring Meeting (2012 : San Francisco, Calif.)
Publication, Distribution, etc.: Cambridge : Cambridge University Press
Warrendale : Materials Research Society
Publication Date: c2012.
Publication Date (W3CDTF): 2012
Extent: 87 p.
Other physical details: ill.
Size: 24 cm.
Additional Title: 2012 MRS spring meeting.
Place of Publication (Country Code): GB
Text Language Code: eng
Subject Heading: Metal oxide semiconductors, Complementary--Design and construction--Congresses.
Materials--Research--Congresses.
CMOS technology
Interconnect challenges
3D stacking
Downscaling
Packaging
Reliability
MRS
LCC: TK7871.99.M44
DDC: 621.38152
NDLC: M17
Target Audience: 一般
Note (General): Papers.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-13-3096
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024585404
http://id.ndl.go.jp/bib/024585404
OCLC No.: 850328143
https://www.worldcat.org/oclc/850328143
Cataloging Rule: Anglo-American Cataloging Rules
Bibliographic Record Category (NDL): 215