Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.

• 資料種別: 図書
• ISBN: 9780791855751 (v. 1); 0791855759 (v. 1); 9780791855768 (v. 2); 0791855767 (v. 2)
• タイトル: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.
• 著者標目: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2013 : Burlingame, California)
• 出版事項: New York, N.Y. : ASME (出版)
• 出版年月日等: [2014]
• 出版年（W3CDTF）: 2014
• 数量: 2 volumes
• 形態の詳細: illustrations
• 大きさ: 28 cm
• 並列タイトル等: 2013 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : InterPACK2013
• 出版地（国名コード）: US
• 本文の言語コード: eng
• ジャンル・形式用語: Conference proceedings.
• 表現種別: text
• 機器種別: unmediated
• キャリア種別: volume
• 件名標目: Electronic packaging--Congresses.; Electronic packaging.
• NDLC: M17
• 対象利用者: 一般
• 一般注記: Papers.; "The InterPACK Conference Series ... It was renamed InterPACK in 1995, and has been occurring biannually since then."--Welcome.
• 書誌注記: Includes bibliographical references and author indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-14-2930
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 025478666; http://id.ndl.go.jp/bib/025478666
• OCLC番号: 880138412; https://www.worldcat.org/oclc/880138412
• 目録規則: RDA
• 整理区分コード: 215

• 内容細目: v. 1. Advanced packaging ; Emerging technologies ; Modeling and simulation ; Multi-physics based reliability ; MEMS and NEMS ; Materials and processes...