Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.

• Material Type: 図書
• ISBN: 9780791855751 (v. 1); 0791855759 (v. 1); 9780791855768 (v. 2); 0791855767 (v. 2)
• Title: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2013-- : presented at ASME 2013 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 16-18, 2013 : Burlingame, Califronia, USA : InterPACK 2013 : Jul 2013, Burlingame, CA.
• Author Heading: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2013 : Burlingame, California)
• Publication, Distribution, etc.: New York, N.Y. : ASME (出版)
• Publication Date: [2014]
• Publication Date (W3CDTF): 2014
• Extent: 2 volumes
• Other physical details: illustrations
• Size: 28 cm
• Alternative Title: 2013 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : InterPACK2013
• Place of Publication (Country Code): US
• Text Language Code: eng
• Genre/Form Terms: Conference proceedings.
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Electronic packaging--Congresses.; Electronic packaging.
• NDLC: M17
• Target Audience: 一般
• Note (General): Papers.; "The InterPACK Conference Series ... It was renamed InterPACK in 1995, and has been occurring biannually since then."--Welcome.
• Note (Bibliography): Includes bibliographical references and author indexes.
• Holding library: 国立国会図書館
• Call No.: M17-14-2930
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 025478666; http://id.ndl.go.jp/bib/025478666
• OCLC No.: 880138412; https://www.worldcat.org/oclc/880138412
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 215

• Contents: v. 1. Advanced packaging ; Emerging technologies ; Modeling and simulation ; Multi-physics based reliability ; MEMS and NEMS ; Materials and processes...