Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan.

• 資料種別: 図書
• ISBN: 9780735412354 (Original Print); 0735412359; 9781632667410 (Print on Demand); 163266741X
• ISSN（シリーズ）: 0094-243X
• タイトル: Stress induced phenomena and reliability in 3D microelectronics : Kyoto, Japan : 28-30 May 2012 : international workshops "stress management for 3D ICs using through silicon vias--design for reliability" : 12th international workshop on stress-induced phenomena in microelectronics : May 2012, Kyoto, Japan.
• シリーズタイトル: AIP Conference Proceedings ; 1601
• タイトル標目: AIP conference proceedings ; no. 1601. 0094-243X
• 著者標目: author. ： International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 March 17 : Santa Clara, Calif.); Ho, P. S.; Hu, Chao-Kun. IBM T.J. Watson Research Center, New York, USA.; Nakamoto, Mark.; Ogawa, Shinichi.; Sukharev, Valeriy.; Smith, Larry. SEMATECH, New York, USA.; Zschech, Ehrenfried.; author. ： International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 July 13 : San Francisco, Calif.); author. ： International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2011 October 12 : Dresden, Germany); author. ： International Workshop on Stress-Induced Phenomena in Microelectronics (12th : 2012 : Kyoto, Japan)
• 出版事項: Melville, New York : American Institute of Physics (出版); Red Hook, NY : printed by Curran Associates, Inc. (製作)
• 出版年月日等: 2014.
• 出版年（W3CDTF）: 2014
• 数量: vi, 185 pages
• 形態の詳細: illustrations
• 大きさ: 27 cm.
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 表現種別: text
• 機器種別: unmediated
• キャリア種別: volume
• 件名標目: Three-dimensional integrated circuits--Congresses.; Interconnects (Integrated circuit technology)--Defects--Congresses.; Metal-metal bonds--Congresses.; Strength of materials--Congresses.; Nanostructured materials--Congresses.; Semiconductors--Congresses.; Copper--Electric properties--Congresses.
• LCC: TK7874.893
• NDLC: M17
• 対象利用者: 一般
• 一般注記: Papers.; "This volume of proceedings contains papers from three International Workshops 'Stress Management for 3D ICs using Through Silicon Vias--Design for Reliability' held in Santa Clara/CA, USA, on March 17, 2011, in San Francisco/CA, USA, on July 13, 2011, and in Dresden, Germany, on October 12, 2011, as well as from the 12th International Workshop on Stress-Induced Phenomena in Microelectronics held in Kyoto, Japan, on May 28-30, 2012."--Preface.; "Conference collection."
• 書誌注記: Includes bibliographical references.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-15-831
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 025624099; http://id.ndl.go.jp/bib/025624099
• 目録規則: RDA
• 整理区分コード: 215