Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.
Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.
国立国会図書館請求記号
M17-19-909
国立国会図書館書誌ID
028818965
資料種別
図書
著者
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2017 : San Francisco, Calif.)
Papers."... the InterPACK Advisory Committee (IAC) and EPPD Executive Committee decided in 2015 that InterPACK will be held annually starting 2017."--...
2017 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2017
"... the InterPACK Advisory Committee (IAC) and EPPD Executive Committee decided in 2015 that InterPACK will be held annually starting 2017."--Page iii.
書誌注記
Includes bibliographical references and author index.