Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.

Call No. (NDL): M17-19-909
Bibliographic ID of National Diet Library: 028818965

Material type: 図書

Author: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2017 : San Francisco, Calif.)

Publisher: The American Society of Mechanical Engineers

Publication date: [2017]

Material Format: Paper

Capacity, size, etc.: 1 volume (various pagings) ; 28 cm

NDC: -

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Notes on use

Note (General)：: Papers."... the InterPACK Advisory Committee (IAC) and EPPD Executive Committee decided in 2015 that InterPACK will be held annually starting 2017."--...

Other physical details：: illustrations

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Paper

Material Type: 図書
ISBN: 9780791858097
Title: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.
Author Heading: creator. ： ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2017 : San Francisco, Calif.)
Publication, Distribution, etc.: New York, N.Y. : The American Society of Mechanical Engineers (出版)
Publication Date: [2017]
Publication Date (W3CDTF): 2017
Extent: 1 volume (various pagings)
Other physical details: illustrations
Size: 28 cm
Alternative Title: 2017 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2017
Place of Publication (Country Code): US
Text Language Code: eng
Genre/Form Terms: Conference papers and proceedings.
Content Type: txt : text
Media Type: n : unmediated
Carrier Type: nc : volume
Subject Heading: Electronic packaging--Congresses.
Electronic packaging.
LCC: TK7870.15
NDLC: M17
Target Audience: 一般
Note (General): Papers.
"... the InterPACK Advisory Committee (IAC) and EPPD Executive Committee decided in 2015 that InterPACK will be held annually starting 2017."--Page iii.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-19-909
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 028818965
http://id.ndl.go.jp/bib/028818965
OCLC No.: 1020494071
https://www.worldcat.org/oclc/1020494071
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215