Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

国立国会図書館請求記号: M17-20-1371
国立国会図書館書誌ID: 030473724

資料種別: 図書

著者: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.)

出版者: The American Society of Mechanical Engineers

出版年: [2020]

資料形態: 紙

ページ数・大きさ等: 1 volume (various pagings) ; 28 cm

NDC: -

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資料に関する注記

一般注記：: Papers."The organizers have developed a comprehensive technical program, with nearly 235 technical papers and presentations, close to 100 papers, as w...

形態の詳細：: illustrations

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紙

資料種別: 図書
ISBN: 9780791859322
タイトル: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.
著者標目: creator. ： ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.)
出版事項: New York, N.Y. : The American Society of Mechanical Engineers (出版)
出版年（W3CDTF）: 2020
数量: 1 volume (various pagings)
形態の詳細: illustrations
大きさ: 28 cm
並列タイトル等: 2019 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2019
出版地（国名コード）: US
本文の言語コード: eng
ジャンル・形式用語: Conference papers and proceedings.
表現種別: txt : text
機器種別: n : unmediated
キャリア種別: nc : volume
件名標目: Electronic packaging--Congresses.
Electronic packaging.
LCC: TK7870.15
DDC: 621.381046
NDLC: M17
対象利用者: 一般
一般注記: Papers.
"The organizers have developed a comprehensive technical program, with nearly 235 technical papers and presentations, close to 100 papers, as well as tutorials, panels, workshops, and ..."--Page iii.
書誌注記: Includes bibliographical references and author index.
所蔵機関: 国立国会図書館
請求記号: M17-20-1371
関連情報: https://www.asme.org
連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
書誌ID（NDLBibID）: 030473724
http://id.ndl.go.jp/bib/030473724
OCLC番号: 1157236309
https://www.worldcat.org/oclc/1157236309
目録規則: RDA
整理区分コード: 215