Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Call No. (NDL): M17-20-1371
Bibliographic ID of National Diet Library: 030473724

Material type: 図書

Author: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.)

Publisher: The American Society of Mechanical Engineers

Publication date: [2020]

Material Format: Paper

Capacity, size, etc.: 1 volume (various pagings) ; 28 cm

NDC: -

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Notes on use

Note (General)：: Papers."The organizers have developed a comprehensive technical program, with nearly 235 technical papers and presentations, close to 100 papers, as w...

Other physical details：: illustrations

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Paper

Material Type: 図書
ISBN: 9780791859322
Title: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.
Author Heading: creator. ： ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2019 : Anaheim, Calif.)
Publication, Distribution, etc.: New York, N.Y. : The American Society of Mechanical Engineers (出版)
Publication Date (W3CDTF): 2020
Extent: 1 volume (various pagings)
Other physical details: illustrations
Size: 28 cm
Alternative Title: 2019 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2019
Place of Publication (Country Code): US
Text Language Code: eng
Genre/Form Terms: Conference papers and proceedings.
Content Type: txt : text
Media Type: n : unmediated
Carrier Type: nc : volume
Subject Heading: Electronic packaging--Congresses.
Electronic packaging.
LCC: TK7870.15
DDC: 621.381046
NDLC: M17
Target Audience: 一般
Note (General): Papers.
"The organizers have developed a comprehensive technical program, with nearly 235 technical papers and presentations, close to 100 papers, as well as tutorials, panels, workshops, and ..."--Page iii.
Note (Bibliography): Includes bibliographical references and author index.
Holding library: 国立国会図書館
Call No.: M17-20-1371
Related Material: https://www.asme.org
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 030473724
http://id.ndl.go.jp/bib/030473724
OCLC No.: 1157236309
https://www.worldcat.org/oclc/1157236309
Cataloging Rule: RDA
Bibliographic Record Category (NDL): 215