数量1 volume (various pagings)
形態の詳細illustrations (black and white)
並列タイトル等2021 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : InterPACK2021
一般注記Papers.
"... the organizers have developed a comprehensive technical program comprising nearly 140 technical papers and presentations, ... as well as tutorials, panels, workshops, ..."--Next page of title page verso.
"Furthermore, we are pleased to have a panel ... and tutorials ... Last but not least, we will hold the Artificial Intelligence workshop ... in addition to the other comprehensive professional development workshops ..."--Next page of title page verso.
書誌注記Includes bibliographical references.