Proceedings of ASME 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2021) : October 26-28, 2021 : virtual, online.

• Material Type: 図書
• ISBN: 9780791885505 paperback; 079188550X
• Title: Proceedings of ASME 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2021) : October 26-28, 2021 : virtual, online.
• Author Heading: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2021 : Online); American Society of Mechanical Engineers. Electronic and Photonic Packaging Division.
• Publication, Distribution, etc.: New York, NY : The American Society of Mechanical Engineers (ASME) (出版)
• Publication Date: [2021]
• Publication Date (W3CDTF): 2021
• Extent: 1 volume (various pagings)
• Other physical details: illustrations (black and white)
• Size: 28 cm
• Alternative Title: 2021 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : InterPACK2021
• Additional Title: InterPACK : artificial intelligence workshop : Oct 2021.
• Place of Publication (Country Code): US
• Text Language Code: eng
• Genre/Form Terms: Conference papers and proceedings.
• Content Type: text
• Media Type: unmediated
• Carrier Type: volume
• Subject Heading: Electronic packaging--Congresses.; Data centers--Congresses.; Cloud computing--Congresses.; Client/server computing--Equipment and supplies--Congresses.; Wearable technology--Congresses.; Power electronics--Congresses.; Heat--Transmission--Congresses.; Automated vehicles--Congresses.; Electric automobiles--Congresses.; Nanotechnology--Congresses.; Mise sous boîtier (Électronique)--Congrès.; Centres de traitement de l'information--Congrès.; Infonuagique--Congrès.; Architecture client-serveur (Informatique)--Appareils et matériel--Congrès.; Technologie prêt-à-porter--Congrès.; Électronique de puissance--Congrès.; Chaleur--Transmission--Congrès.; Véhicules autonomes--Congrès.; Automobiles électriques--Congrès.; Automated vehicles.; Client/server computing--Equipment and supplies.; Cloud computing.; Data centers.; Electric automobiles.; Electronic packaging.; Heat--Transmission.; Nanotechnology.; Power electronics.; Wearable technology.
• LCC: TK7870.15
• NDLC: M17
• Target Audience: 一般
• Note (General): Papers.; "... the organizers have developed a comprehensive technical program comprising nearly 140 technical papers and presentations, ... as well as tutorials, panels, workshops, ..."--Next page of title page verso.; "Furthermore, we are pleased to have a panel ... and tutorials ... Last but not least, we will hold the Artificial Intelligence workshop ... in addition to the other comprehensive professional development workshops ..."--Next page of title page verso.
• Note (Bibliography): Includes bibliographical references.
• Holding library: 国立国会図書館
• Call No.: M17-22-575
• Related Material: https://www.asme.org : 1850-9999
• Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 031994638; http://id.ndl.go.jp/bib/031994638
• OCLC No.: 1308592818; https://www.worldcat.org/oclc/1308592818
• Cataloging Rule: RDA
• Bibliographic Record Category (NDL): 215