Encyclopedia of thermal packaging

• 資料種別: 図書
• タイトル: Encyclopedia of thermal packaging
• 出版事項: World Scientific
• 並列タイトル等: Encyclopedia of thermal packaging : a guide to cooling of electronic equipment
• 出版地（国名コード）: us
• 対象利用者: 一般
• 一般注記: Editor-in-chief: Avram Bar-Cohen; Series title of set 2: Encyclopedia of thermal packaging : a guide to cooling of electronic equipment
• 関連情報: Cooling of microelectronic and nanoelectronic equipment : advances and emerging research; https://cir.nii.ac.jp/crid/1130000795190301696; Dielectric liquid cooling of immersed components; https://cir.nii.ac.jp/crid/1130000797401647488; Thermally-informed design of microelectronic components; https://cir.nii.ac.jp/crid/1130000797615984384; Experimental thermofluid characterization of electronic components; https://cir.nii.ac.jp/crid/1130000798140345984; Compact thermal models of electronic components; https://cir.nii.ac.jp/crid/1130282268650146560; Thermoelectric microcoolers; https://cir.nii.ac.jp/crid/1130282268861887616; Air- and liquid-cooled cold plates; https://cir.nii.ac.jp/crid/1130282269387918208; Energy efficient solid state lighting; https://cir.nii.ac.jp/crid/1130282269577835136; Energy optimization and thermal management of data centers; https://cir.nii.ac.jp/crid/1130282270294340864; Microchannel heat sinks for electronics cooling; https://cir.nii.ac.jp/crid/1130282272458847488
• 関連情報（URI）: https://ci.nii.ac.jp/ncid/BB17392030#entity
• 連携機関・データベース: 国立情報学研究所 : CiNii Research
• 提供元機関・データベース: CiNii Books; https://ci.nii.ac.jp/books
• NACSIS書誌ID（NCID）: https://ci.nii.ac.jp/ncid/BB17392030 : BB17392030