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Paper

Material Type
図書
Publication, Distribution, etc.
Alternative Title
Encyclopedia of thermal packaging : a guide to cooling of electronic equipment
Place of Publication (Country Code)
us
Target Audience
一般
Note (General)
Editor-in-chief: Avram Bar-Cohen
Series title of set 2: Encyclopedia of thermal packaging : a guide to cooling of electronic equipment
Related Material
Cooling of microelectronic and nanoelectronic equipment : advances and emerging research
Dielectric liquid cooling of immersed components
Thermally-informed design of microelectronic components
Experimental thermofluid characterization of electronic components
Compact thermal models of electronic components
Thermoelectric microcoolers
Air- and liquid-cooled cold plates
Energy efficient solid state lighting
Energy optimization and thermal management of data centers
Microchannel heat sinks for electronics cooling
Data Provider (Database)
国立情報学研究所 : CiNii Research