Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012

• 資料種別: 図書
• ISBN: 9781632667410
• タイトル: Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012
• 著者・編者: Paul S. Ho ... [et al.], editors
• 著者標目: Ho, P. S.; https://ci.nii.ac.jp/author/DA01675942; Hu, Chao-Kun; Nakamoto, Mark; Ogawa, Shinichi; Sukharev, Valeriy; Smith, Larry; Zschech, Ehrenfried
• 出版事項: Curran Associate
• 出版年月日等: c2014
• 出版年（W3CDTF）: 2014
• 大きさ: 28 cm
• 出版地（国名コード）: us
• 本文の言語コード: en
• 件名標目: Three-dimensional integrated circuits; Interconnects (Integrated circuit technology); Metal-metal bonds; Strength of materials -- Congresses; Nanostructured materials -- Congresses; Semiconductors -- Congresses
• 対象利用者: 一般
• 一般注記: Includes bibliographical references; Other editors: Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Valeriy Sukharev, Larry Smith, Ehrenfried Zschech; Orginally published: Melville, N.Y. : American Institute of Physics , c2014; "Print on demand"--Leaf preceding t.p
• 関連情報: AIP conference proceedings; https://cir.nii.ac.jp/crid/1130282270712970496
• 関連情報（URI）: https://ci.nii.ac.jp/ncid/BB24742609#entity
• 掲載誌: AIP conference proceedings; https://cir.nii.ac.jp/crid/1130282270712970496
• 連携機関・データベース: 国立情報学研究所 : CiNii Research
• 提供元機関・データベース: CiNii Books; https://ci.nii.ac.jp/books
• NACSIS書誌ID（NCID）: https://ci.nii.ac.jp/ncid/BB24742609 : BB24742609