Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012

Material type: 図書

Author: Paul S. Ho ... [et al.], editors

Publisher: Curran Associate

Publication date: c2014

Material Format: Paper

Capacity, size, etc.: 28 cm

NDC: -

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Note (General)：: Includes bibliographical referencesOther editors: Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Valeriy Sukharev, Larry Smith, Ehrenfried ZschechOrginal...

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Paper

Material Type: 図書
ISBN: 9781632667410
Title: Stress induced phenomiena and reliability in 3D microelectronics, Kyoto, Japan, 28-30 May 2012
Author/Editor: Paul S. Ho ... [et al.], editors
Author Heading: Ho, P. S.
https://ci.nii.ac.jp/author/DA01675942
Hu, Chao-Kun
Nakamoto, Mark
Ogawa, Shinichi
Sukharev, Valeriy
Smith, Larry
Zschech, Ehrenfried
Publication, Distribution, etc.: Curran Associate
Publication Date: c2014
Publication Date (W3CDTF): 2014
Size: 28 cm
Place of Publication (Country Code): us
Text Language Code: en
Subject Heading: Three-dimensional integrated circuits
Interconnects (Integrated circuit technology)
Metal-metal bonds
Strength of materials -- Congresses
Nanostructured materials -- Congresses
Semiconductors -- Congresses
Target Audience: 一般
Note (General): Includes bibliographical references
Other editors: Chao-Kun Hu, Mark Nakamoto, Shinichi Ogawa, Valeriy Sukharev, Larry Smith, Ehrenfried Zschech
Orginally published: Melville, N.Y. : American Institute of Physics , c2014
"Print on demand"--Leaf preceding t.p
Related Material: AIP conference proceedings
https://cir.nii.ac.jp/crid/1130282270712970496
Related Material (URI): https://ci.nii.ac.jp/ncid/BB24742609#entity
Periodical Title: AIP conference proceedings
https://cir.nii.ac.jp/crid/1130282270712970496
Data Provider (Database): 国立情報学研究所 : CiNii Research
Original Data Provider (Database): CiNii Books
https://ci.nii.ac.jp/books
NCID: https://ci.nii.ac.jp/ncid/BB24742609 : BB24742609