半導体パッケージ基板用無電解Ni/Pd/Auめっき技術(第1報)はんだボール接続信頼性に及ぼす無電解Niめっき膜厚の影響
Digital data available（Japan Link Center）
Begin reading now
CiNii Research
Holdings of Libraries in Japan
This page shows libraries in Japan other than the National Diet Library that hold the material.
Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.
other
CiNii Research
Search ServiceDigitalYou can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Bibliographic Record
You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.
- Material Type
- 記事
- Author/Editor
- 江尻 芳則櫻井 健久荒山 貴慎 他
- Alternative Title
- Electroless Ni/Pd/Au Plating for Semiconductor Package Substrates (1) Influence of the Electroless Ni Plating Thickness on the Solder Ball Joint Reliability
- Periodical title
- エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
- No. or year of volume/issue
- 15(1)=98:2012.1
- Volume
- 15
- Issue
- 1
- Sequential issue number
- 98