コンデンサやインダクタの小型化・薄型化動向とその要素技術(特集スマートモバイル機器の部品・実装技術動向)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 16(4)=108:2013.7

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Material Type: 記事
Title: コンデンサやインダクタの小型化・薄型化動向とその要素技術
Author/Editor: 井上泰史
小原将孝
Series Title: 特集スマートモバイル機器の部品・実装技術動向
Author Heading: 井上泰史
小原将孝
Alternative Title: The Case Size and Thickness Trend of Capacitors and Inductors, and Those Element Technologies
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 16(4)=108:2013.7
Volume: 16
Issue: 4
Sequential issue number: 108
Pages: 270-274
Publication date of volume/issue (W3CDTF): 2013-07
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024792827
http://id.ndl.go.jp/bib/024792827
Bibliographic Record Category (NDL): 632