結晶粒径の異なる銅薄膜のヒロック形成温度と初期残留応力の関係 (特集 X線材料強度)
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- Material Type
- 記事
- Author/Editor
- 日下 一也山田 祐馬
- Series Title
- Alternative Title
- The Relationship between Hillock Formation Temperature and Initial Residual Stress in Copper Thin Films with Different Crystal Grain Size
- Periodical title
- 材料 / 日本材料学会 [編]
- No. or year of volume/issue
- 62(7):2013.7
- Volume
- 62
- Issue
- 7