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雑誌材料
結晶粒径の異なる銅薄...

結晶粒径の異なる銅薄膜のヒロック形成温度と初期残留応力の関係 (特集 X線材料強度)

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結晶粒径の異なる銅薄膜のヒロック形成温度と初期残留応力の関係(特集 X線材料強度)

Call No. (NDL)
Z14-267
Bibliographic ID of National Diet Library
024804563
Material type
記事
Author
日下 一也ほか
Publisher
京都 : 日本材料学会
Publication date
2013-07
Material Format
Paper
Journal name
材料 / 日本材料学会 [編] 62(7):2013.7
Publication Page
p.457-463
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Paper Digital

Material Type
記事
Author/Editor
日下 一也
山田 祐馬
Alternative Title
The Relationship between Hillock Formation Temperature and Initial Residual Stress in Copper Thin Films with Different Crystal Grain Size
Periodical title
材料 / 日本材料学会 [編]
No. or year of volume/issue
62(7):2013.7
Volume
62
Issue
7