低誘電損失材料および高周波デバイス用銅張積層板の開発(特集情報・環境・エネルギと材料技術 ; 高周波基板技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 16(5)=109:2013.8

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Material Type: 記事
Title: 低誘電損失材料および高周波デバイス用銅張積層板の開発
Author/Editor: 布重純
Series Title: 特集情報・環境・エネルギと材料技術 ; 高周波基板技術
Author Heading: 布重純
Alternative Title: Development of Copper Clad Laminate with Low Dielectric Loss Materials for High Frequency Devices
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 16(5)=109:2013.8
Volume: 16
Issue: 5
Sequential issue number: 109
Pages: 389-393
Publication date of volume/issue (W3CDTF): 2013-08
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024834873
http://id.ndl.go.jp/bib/024834873
Bibliographic Record Category (NDL): 632