半導体パッケージ基板用ビルドアップ材料の最新の技術動向 (小特集 プリント配線板における表面処理の動向)
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CiNii Research
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- Material Type
- 記事
- Author/Editor
- 真子 玄迅
- Series Title
- Author Heading
- Alternative Title
- Recent Trend of Build-Up Dielectric Materials for IC Package Substrates
- Periodical title
- 表面技術 = Journal of the Surface Finishing Society of Japan
- No. or year of volume/issue
- 65(8):2014.8
- Volume
- 65
- Issue
- 8