スチールチップ補強セメント系複合材料の引張クリープを考慮した乾燥収縮ひび割れの予測
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- Material Type
- 記事
- Author/Editor
- 木村 真也洪 善煕田中 大貴 他
- Alternative Title
- Prediction of Drying Shrinkage Cracking of Steel Chip Reinforced Cementitious Composite Considering Tensile Creep
- Periodical title
- 材料 / 日本材料学会 [編]
- No. or year of volume/issue
- 64(8):2015.8
- Volume
- 64
- Issue
- 8
- Pages
- 628-633