バウンダリスキャンテスト機構を用いたはんだ接合部の電気検査法とその組込型検査回路(特集ものづくりイノベーションにおけるプロセス評価と検査)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 19(3)=128:2016.5

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Material Type: 記事
Title: バウンダリスキャンテスト機構を用いたはんだ接合部の電気検査法とその組込型検査回路
Author/Editor: 橋爪正樹
伊喜利勇貴
小西朝陽
四柳浩之
呂學坤
Series Title: 特集ものづくりイノベーションにおけるプロセス評価と検査
Author Heading: 橋爪正樹
伊喜利勇貴
小西朝陽
四柳浩之
呂學坤
Alternative Title: Electrical Interconnect Test of Solder Joint Part with Boundary Scan Flip Flops and a Built-in Test Circuit
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 19(3)=128:2016.5
Volume: 19
Issue: 3
Sequential issue number: 128
Pages: 161-165
Publication date of volume/issue (W3CDTF): 2016-05
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027561094
http://id.ndl.go.jp/bib/027561094
Bibliographic Record Category (NDL): 632