Niめっき/Sn-0.7Cuはんだ接合界面の高耐熱化技術

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Material Type: 記事
Title: Niめっき/Sn-0.7Cuはんだ接合界面の高耐熱化技術
Author/Editor: 門口卓矢
武直矢
山中公博
長尾至成
菅沼克昭
Author Heading: 門口卓矢
武直矢
山中公博
長尾至成
菅沼克昭
Alternative Title: High thermo-stability of Ni plating/Sn-0.7Cu based joint system
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 25:2015.9.3・4
Volume: 25
Pages: 17-20
Publication date of volume/issue (W3CDTF): 2015-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 027771899
http://id.ndl.go.jp/bib/027771899
Bibliographic Record Category (NDL): 632