Sn-Ag-Bi-In-Cu系はんだの接合信頼性に及ぼす熱サイクル負荷とSb添加の影響

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
Digital
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: Sn-Ag-Bi-In-Cu系はんだの接合信頼性に及ぼす熱サイクル負荷とSb添加の影響
Author/Editor: 三原一樹
日根清裕
酒谷茂昭
秋山真之介
上西啓介
Author Heading: 三原一樹
日根清裕
酒谷茂昭
秋山真之介
上西啓介
Alternative Title: The Effect of Thermal Cycle and Addition of Sb on Joint Reliability of Sn-Ag-Bi-In-Cu Solder
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 27:2017.8.29・30
Volume: 27
Pages: 157-160
Publication date of volume/issue (W3CDTF): 2017-08
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 028549568
http://id.ndl.go.jp/bib/028549568
Bibliographic Record Category (NDL): 632