AI・IoT時代に向...

AI・IoT時代に向けた三次元集積実装技術の研究開発 (特集 三次元積層集積デバイスによる半導体集積回路技術の進展と展望)

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AI・IoT時代に向けた三次元集積実装技術の研究開発(特集 三次元積層集積デバイスによる半導体集積回路技術の進展と展望)

Call No. (NDL)
Z16-474
Bibliographic ID of National Diet Library
030112624
Material type
記事
Author
菊地 克弥
Publisher
東京 : 日本表面科学会 ; 2018-
Publication date
2019-11
Material Format
Paper
Journal name
表面と真空 = Vacuum and surface science / 日本表面科学会, 日本真空学会 編 62(11):2019.11
Publication Page
p.666-671
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Paper Digital

Material Type
記事
Author/Editor
菊地 克弥
Author Heading
Alternative Title
R&D of 3D-IC Technology for the AI・IoT Era
Periodical title
表面と真空 = Vacuum and surface science / 日本表面科学会, 日本真空学会 編
No. or year of volume/issue
62(11):2019.11
Volume
62
Issue
11