LDSを用いたMIDに適応した無電解めっきプロセス(小特集成形回路部品(MID)の最前線)

Journal name: 表面技術 = Journal of the Surface Finishing Society of Japan 71(4):2020.4

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Material Type: 記事
Title: LDSを用いたMIDに適応した無電解めっきプロセス
Author/Editor: 北原悠平
Series Title: 小特集成形回路部品(MID)の最前線
Author Heading: 北原悠平
Alternative Title: Electroless Copper Plating Process Applicable to Molded Interconnect Device Using Laser Direct Structuring
Periodical title: 表面技術 = Journal of the Surface Finishing Society of Japan
No. or year of volume/issue: 71(4):2020.4
Volume: 71
Issue: 4
Pages: 277-281
Publication date of volume/issue (W3CDTF): 2020-04
ISSN (Periodical Title): 0915-1869
ISSN-L (Periodical Title): 0915-1869
Publication (Periodical Title): 東京 : 表面技術協会
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: Electroless Copper Plating
Plating Catalyst
Laser Patterning
Additive Process
NDLC: ZP41
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z17-291
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 030403274
http://id.ndl.go.jp/bib/030403274
Bibliographic Record Category (NDL): 632

DOI: 10.4139/sfj.71.277
https://doi.org/10.4139/sfj.71.277
Related Material (URI): http://id.ndl.go.jp/bib/030403274
https://ndlsearch.ndl.go.jp/books/R000000004-I030403274
https://www.jstage.jst.go.jp/article/sfj/71/4/71_277/_pdf
References: めっきの基本組成の役割　　無電解銅めっき
https://cir.nii.ac.jp/crid/1390001204115051904
エレクトロニクス産業におけるめっき技術　　立体配線技術‐ＭＩＤのめっき技術
https://cir.nii.ac.jp/crid/1390001204115654144
無電解銅めっきの物性
https://cir.nii.ac.jp/crid/1390001204666662528
無電解銅めっきの現状と将来
https://cir.nii.ac.jp/crid/1390282679094209024
MID：金属・樹脂複合体が目指すもの
https://cir.nii.ac.jp/crid/1390282679537387008
Data Provider (Database): 国立情報学研究所 : CiNii Research
https://cir.nii.ac.jp/
Original Data Provider (Database): Japan Link Center
https://japanlinkcenter.org/top
雑誌記事索引データベース
https://ndlsearch.ndl.go.jp
Crossref
https://www.crossref.org
CiNii Articles
Bibliographic ID (NDL): 030403274
http://id.ndl.go.jp/bib/030403274
NAID: 130007920182