低温固相接合に向けた銅表面微細粗化と銅粒子霧化積層

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Material Type: 記事
Title: 低温固相接合に向けた銅表面微細粗化と銅粒子霧化積層
Author/Editor: 髙田侑希
伊藤智也
安田清和
Author Heading: 髙田侑希
伊藤智也
安田清和
Alternative Title: Micro Roughening of Copper Surface and Additive Spraying of Copper Particles for Low Temperature Solid Phase Bonding
Periodical title: マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue: 29:2019.9.12・13
Volume: 29
Pages: 23-26
Publication date of volume/issue (W3CDTF): 2019-09
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1617
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 030550449
http://id.ndl.go.jp/bib/030550449
Bibliographic Record Category (NDL): 632