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深紫外LED向けシリコンパッケージング技術の開発

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深紫外LED向けシリコンパッケージング技術の開発

Call No. (NDL)
YH247-299
Bibliographic ID of National Diet Library
031475621
Material type
記事
Author
千葉 広文ほか
Publisher
[東京] : Institute of Electrical Engineers of Japan
Publication date
2019-11
Material Format
Recording Media
Journal name
「センサ・マイクロマシンと応用システム」シンポジウム論文集 電気学会センサ・マイクロマシン部門 [編] 36:2019.11.19-21
Publication Page
p.5p
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Recording Media

Material Type
記事
Author/Editor
千葉 広文
鈴木 裕輝夫
安田 喜昭
熊谷 光恭
小山 孝明
田中 秀治
Alternative Title
Development of Silicon Wafer Packaging Technology for Deep UV LED
Periodical title
「センサ・マイクロマシンと応用システム」シンポジウム論文集 電気学会センサ・マイクロマシン部門 [編]
No. or year of volume/issue
36:2019.11.19-21
Volume
36
Pages
5p
Publication date of volume/issue (W3CDTF)
2019-11