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金薄膜を用いた常温接...

金薄膜を用いた常温接合によるセンサ・MEMS作製

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金薄膜を用いた常温接合によるセンサ・MEMS作製

Call No. (NDL)
Z15-243
Bibliographic ID of National Diet Library
031761206
Material type
記事
Author
日暮 栄治ほか
Publisher
東京 : 応用物理学会
Publication date
2021-10
Material Format
Paper
Journal name
応用物理 90(10)=1031:2021.10
Publication Page
p.623-627
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Paper Digital

Material Type
記事
Author/Editor
日暮 栄治
松前 貴司
倉島 優一
高木 秀樹
Alternative Title
Fabrication of sensors and MEMS by room-temperature bonding using gold thin films
Periodical title
応用物理
No. or year of volume/issue
90(10)=1031:2021.10
Volume
90
Issue
10
Sequential issue number
1031