雑誌スマートプロセス学会誌
Volume number10巻6号 2021年11月
Article半導体の多機能化に貢...

半導体の多機能化に貢献する粘着・接着フィルム材料 (異種・異材×接着・接合技術が拓く未来)

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半導体の多機能化に貢献する粘着・接着フィルム材料

(異種・異材×接着・接合技術が拓く未来)

Call No. (NDL)
Z74-H317
Bibliographic ID of National Diet Library
031825856
Material type
記事
Author
市川 功
Publisher
大阪 : 高温学会
Publication date
2021-11
Material Format
Paper
Journal name
スマートプロセス学会誌 = Journal of smart processing 10(6):2021.11
Publication Page
p.344-350
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Paper

Material Type
記事
Title
半導体の多機能化に貢献する粘着・接着フィルム材料
Author/Editor
市川 功
Series Title
異種・異材×接着・接合技術が拓く未来
Author Heading
市川 功
Alternative Title
The Film-formed Adhesive Material for the Semiconductor Assembly Contributing to the Development of New Products
Periodical title
スマートプロセス学会誌 = Journal of smart processing
No. or year of volume/issue
10(6):2021.11
Volume
10
Issue
6