Sn-Sb-Ag系高温鉛フリーはんだの疲労特性に及ぼす添加元素の影響

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 26(3)=177:2023.5

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Material Type: 記事
Title: Sn-Sb-Ag系高温鉛フリーはんだの疲労特性に及ぼす添加元素の影響
Author/Editor: 三ツ井恒平
山本瑞貴
川井健太郎
小林竜也
荘司郁夫
渡邉裕彦
Author Heading: 三ツ井恒平
山本瑞貴
川井健太郎
小林竜也
荘司郁夫
渡邉裕彦
Alternative Title: Effect of Additive Element on Fatigue Properties of Sn-Sb-Ag High Temperature Lead-Free Solder
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 26(3)=177:2023.5
Volume: 26
Issue: 3
Sequential issue number: 177
Pages: 266-274
Publication date of volume/issue (W3CDTF): 2023-05
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 032880836
http://id.ndl.go.jp/bib/032880836
Bibliographic Record Category (NDL): 632