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Volume number33:2023.9.6-8
ウエハ接合強度の長期...

ウエハ接合強度の長期負荷及び測定環境の影響

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ウエハ接合強度の長期負荷及び測定環境の影響

Call No. (NDL)
Z16-1617
Bibliographic ID of National Diet Library
033135136
Material type
記事
Author
佐野 麻理恵ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2023-09
Material Format
Paper
Journal name
マイクロエレクトロニクスシンポジウム論文集 33:2023.9.6-8
Publication Page
p.389-391
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Paper Digital

Material Type
記事
Author/Editor
佐野 麻理恵
岩田 知也
布施 淳也
吉原 佑樹
根本 俊介
井上 史大
Alternative Title
Impact of Long-term Stress and Measurement Environment on Bonding Strength
Periodical title
マイクロエレクトロニクスシンポジウム論文集
No. or year of volume/issue
33:2023.9.6-8
Volume
33
Pages
389-391
Publication date of volume/issue (W3CDTF)
2023-09