次世代配線板の現状と展望ランドレスビア配線の電気的優位性(特集エレクトロニクス実装技術の現状と展望)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 27(1)=182:2024.1

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Material Type: 記事
Title: 次世代配線板の現状と展望ランドレスビア配線の電気的優位性
Author/Editor: 配線板製造技術委員会次世代配線板研究会
Series Title: 特集エレクトロニクス実装技術の現状と展望
Author Heading: 配線板製造技術委員会次世代配線板研究会
Alternative Title: The Current Status and Future Outlook of Next-Generation of Wiring Boards Electrical Advantages of Landless Via Wiring
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 27(1)=182:2024.1
Volume: 27
Issue: 1
Sequential issue number: 182
Pages: 22-31
Publication date of volume/issue (W3CDTF): 2024-01
ISSN (Periodical Title): 1343-9677
ISSN-L (Periodical Title): 1343-9677
Publication (Periodical Title): 東京 : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-B258
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 033273704
http://id.ndl.go.jp/bib/033273704
Bibliographic Record Category (NDL): 632