Volume number45巻2号 2024年
パワー半導体向け高耐...

パワー半導体向け高耐熱封止材の開発

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パワー半導体向け高耐熱封止材の開発

Call No. (NDL)
Z17-845
Bibliographic ID of National Diet Library
033406198
Material type
記事
Author
中村 佳樹
Publisher
東京 : 合成樹脂工業協会
Publication date
2024
Material Format
Paper
Journal name
Journal of network polymer, Japan = ネットワークポリマー論文集 45(2):2024
Publication Page
p.112-118
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Paper

Material Type
記事
Author/Editor
中村 佳樹
Author Heading
Alternative Title
Development of high heat-resistance molding compound material for power semiconductors
Periodical title
Journal of network polymer, Japan = ネットワークポリマー論文集
No. or year of volume/issue
45(2):2024
Volume
45
Issue
2
Pages
112-118