Copper Migration into Epoxy at High Temperature : Its Reason, Effect, and Way to Reduce It (特集パワーエレクトロニクスと実装技術)

Copper Migration into Epoxy at High Temperature : Its Reason, Effect, and Way to Reduce It

(特集パワーエレクトロニクスと実装技術)

Journal name: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 28(2)=190:2025.3

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Material Type: 記事
Title: Copper Migration into Epoxy at High Temperature : Its Reason, Effect, and Way to Reduce It
Author/Editor: Shuaijie ZHAO
Series Title: 特集パワーエレクトロニクスと実装技術
Author Heading: Shuaijie ZHAO
Alternative Title: 高温におけるエポキシ樹脂への銅のマイグレーション : 発生原因,影響,そして対策コウオンニオケルエポキシジュシエノドウノマイグレーション : ハッセイゲンイン,エイキョウ,ソシテタイサク
Periodical title: エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue: 28(2)=190:2025.3
Volume: 28
Issue: 2
Sequential issue number: 190
Pages: 190-194
Publication date of volume/issue (W3CDTF): 2025-03
Publication (Periodical Title): [東京] : エレクトロニクス実装学会
Place of Publication (Country Code): JP
Text Language Code: eng
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: YH247-1720
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 033972431
http://id.ndl.go.jp/bib/033972431
Bibliographic Record Category (NDL): 632