Holdings of Libraries in Japan
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Bibliographic Record
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- Material Type
- 記事
- Title
- Author/Editor
- 邱 暁明
- Series Title
- Author Heading
- Alternative Title
- Ultrasonically assisted dicing technology for semiconductor device
- Periodical title
- Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology
- No. or year of volume/issue
- 53(12) (通号 328) 2009.12
- Volume
- 53
- Issue
- 12