半導体デバイスの超音波ダイシング技術 (特集 超音波援用砥粒加工技術の最新動向)

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半導体デバイスの超音波ダイシング技術

(特集 超音波援用砥粒加工技術の最新動向)

Call No. (NDL)
Z16-1147
Bibliographic ID of National Diet Library
10515803
Material type
記事
Author
邱 暁明
Publisher
東京 : 砥粒加工学会
Publication date
2009-12
Material Format
Paper
Journal name
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology 53(12) (通号 328) 2009.12
Publication Page
p.721~724
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Paper

Material Type
記事
Author/Editor
邱 暁明
Author Heading
Alternative Title
Ultrasonically assisted dicing technology for semiconductor device
Periodical title
Abrasive technology : 砥粒加工学会誌 : journal of the Japan Society for Abrasive Technology
No. or year of volume/issue
53(12) (通号 328) 2009.12
Volume
53
Issue
12