CMP-Cu薄膜の表面活性化常温直接接合における真空露出量の影響の評価

Icons representing 記事

CMP-Cu薄膜の表面活性化常温直接接合における真空露出量の影響の評価

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
8027989
Material type
記事
Author
重藤 暁津ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2006-07
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 9(4) (通号 59) 2006.7
Publication Page
p.278~281
View All

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

  • CiNii Research

    Search Service
    You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type
記事
Author/Editor
重藤 暁津
伊藤 寿浩
須賀 唯知
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
9(4) (通号 59) 2006.7
Volume
9
Issue
4
Sequential issue number
59
Pages
278~281