交流インピーダンス法...

交流インピーダンス法を用いたカバーレイコート2層銅張積層板の電気的信頼性評価

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交流インピーダンス法を用いたカバーレイコート2層銅張積層板の電気的信頼性評価

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
9643010
Material type
記事
Author
千葉 大祐ほか
Publisher
東京 : エレクトロニクス実装学会
Publication date
2008-09
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 11(6) (通号 75) 2008.9
Publication Page
p.437~443
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Paper

Material Type
記事
Author/Editor
千葉 大祐
吉原 佐知雄
横山 直樹
Alternative Title
Electric reliability evaluation of cover lay coated double layered copper clad laminate by use of AC impedance spectroscopy
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
11(6) (通号 75) 2008.9
Volume
11
Issue
6
Sequential issue number
75