プリント基板におけるCuダイレクトバイアホールレーザ加工に関する研究--外層銅箔の表面処理が加工穴品質に及ぼす影響

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Material Type: 記事
Title: プリント基板におけるCuダイレクトバイアホールレーザ加工に関する研究--外層銅箔の表面処理が加工穴品質に及ぼす影響
Author/Editor: 廣垣俊樹
青山栄一
小川圭二他
Author Heading: 廣垣俊樹
青山栄一
小川圭二
Alternative Title: Direct laser drilling in copper clad printed wiring boards: effect of surface treatment on drilled blind via-hole quality
Periodical title: 日本機械学会論文集. A編
No. or year of volume/issue: 74(747) 2008.11
Volume: 74
Issue: 747
Pages: 1411～1417
Publication date of volume/issue (W3CDTF): 2008-11
ISSN (Periodical Title): 0387-5008
ISSN-L (Periodical Title): 0387-5008
Publication (Periodical Title): 東京 : 日本機械学会 ; 1979-2010
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: Printed Wiring Boards
Cu-Direct Drilling
CO2 Laser
Absorbance Measurement
Overhang
NDLC: ZM16
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z14-737
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 9729389
http://id.ndl.go.jp/bib/9729389
Bibliographic Record Category (NDL): 632