Siフォトニクスへの応用を目指したUV硬化樹脂を用いたテーパピラー型結合デバイスの検討

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Material Type: 記事
Title: Siフォトニクスへの応用を目指したUV硬化樹脂を用いたテーパピラー型結合デバイスの検討
Volume: 35
0
Author/Editor: 栗澤大河
紙浦欣輝
藤川知栄美
三上修
Author Heading: 栗澤大河
紙浦欣輝
藤川知栄美
三上修
Publication Date: 2021
Publication Date (W3CDTF): 2021
Alternative Title: Coupling Device with Tapered Pillar Fabricated by UV Curable Resin for Silicon Photonics
Periodical title: エレクトロニクス実装学術講演大会講演論文集
Proceedings of JIEP Annual Meeting
No. or year of volume/issue: 35 0
Volume: 35
Issue: 0
Pages: 18C3-02
Target Audience: 一般
DOI: 10.11486/ejisso.35.0_18C3-02
Access Restrictions: インターネット公開
Data Provider (Database): 科学技術振興機構 : J-STAGE
http://www.jstage.jst.go.jp